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An Feng
Employment
Organisation | Role | Department | Start date | End date |
---|---|---|---|---|
AVIC Hongdu | 电子工程师,物联网工程师 | Not specified | 2014-07-25 | 2025 |
江西扬声电子科技有限公司 | 电子工程师&硬件工程师 | Not specified | 2013-07-07 | 2014-06-30 |
Beijing Aerospace Control Device Institute | 电子工程师,物联网工程师 | Not specified | 2010-12-13 | 2013-06-30 |
Education
Organisation | Degree/title | Department | Start date | End date |
---|---|---|---|---|
Indiana University – Purdue University Indianapolis | Master's in Electrical and Computer Engineering | Not specified | 2008-08-15 | 2010-11-01 |
Harbin Institute of Technology | Bachelor's | Not specified | 2004-08-24 | 2008-07-11 |
Works
Title | DOI | Published date |
---|---|---|
基于CPLD和PIC单片机的快速高精度数据采集系统设计 | No DOI available. | 2013-08-28 |
Embedded system for sensor communication and security | 10.1049/iet-ifs.2010.0073 | 2012-06-11 |
Hardware Design for Low Power Integrated Sensor System | No DOI available. | 2012-03-01 |
Temperature/CO2 Sensor Embedded System Based Communications | No DOI available. | 2010-09-15 |
基于Bloom Filter的硬件字符串匹配设计与验证 | No DOI available. | 2009-12-01 |
Finite Element Analysis of Double Curvature and Large-Area Workpiece in Hot Gas Bulge-Forming of Polycarbonate (PC) Sheet | No DOI available. | 2009-11-30 |
Simulation Analysis about Higher Performance of GDCF Over DCF in IEEE 802.11 MAC Layer Protocol | No DOI available. | 2009-05-01 |
Finite Element Analysis of Hemispherical-Shape Parts in the Hot Gas Bulge-Forming of Polycarbonate (PC) Sheet | 10.4028/www.scientific.net/AMM.10-12.140 | 2008-03 |
Octopus publications
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