interconnection
Research Topic
Language: English
This is a research topic created to provide authors with a place to attach new problem publications.
Research topics above this in the hierarchy
Research problems linked to this topic
- There is growing interest in Cu wire bonding for IC (Integrated Circuit) interconnection due to lowered the cost, better the electrical performance and mechanical properties to against the mold flow.
- For the future advanced applications in consumer electronic products, the need of flexible interconnects increases rapidly.
- Flexible interconnects with superconducting (SC) traces and polyimide dielectric can provide low signal loss and low thermal conductivity at cryogenic temperatures, and are expected to find use in densely integrated cryogenic electronics systems.
- The quality and reliability of interconnects in microelectronics is a major challenge considering the increasing level of integration and high current densities.